描述
| Category | Details |
|---|---|
| Specification | – Multi 50 ohm RF transmission lines integrated – Multi-Base Band lines solution – Multi-layer LCP FCCL stack-up, total thickness 0.2mm to 0.67mm – Laser-forming for minimum width 0.9mm |
| Product and Supply Features | – High frequency with significant low loss – Multi-layer（≥10 layers） circuit integration – X in 1 signal lines, 50ohm impedance control – Thickness series for customising requirement – On board directly to transmit signal – As a component to SMT on board – Pre-bending for reliable 3D shape and Die-cut assembly if needed |
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