| Contact Plating |
Tin |
| Chassis |
Surface Mount |
| Mounting Type |
Surface Mount |
| Package/Case |
6-XFDFN Exposed Pad |
| Number of Pins |
6 |
| Usage Level |
Military grade |
| Packaging |
Tape & Reel (TR) |
| Published |
2009 |
| JESD-609 Code |
e4 |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Terminal Surface Treatment |
Gold (Au) |
| Maximum Operating Temperature |
150°C |
| Minimum Operating Temperature |
-55°C |
| Maximum Power Dissipation |
120mW |
| Voltage – Supply |
1.8V~4V |
| Structure |
COMPONENT |
| Frequency |
50MHz~3.5GHz |
| Test Frequency |
1.5GHz |
| Current Source |
30mA |
| Halogen Free |
Halogen Free |
| Gain |
19.5dB |
| RF/Microwave Device Type |
Broadband Low Power |
| RF Type |
Cellular, RKE, WiFi |
| Input Power – Max (CW) |
20dBm |
| Characteristic Impedance |
50Ohm |
| Maximum Junction Temperature (Tj) |
150°C |
| Noise Figure |
1dB |
| P1dB |
-6.5dBm |
| Height |
500μm |
| Radiation Hardening |
None |
| RoHS Status |
ROHS3 Compliant |
| Lead-Free |
Lead-Free |
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