SAM9X75D2GN4 SAM9X75 System-On-Module with 2Gb DDR3L, 4Gb Nand Flash

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描述

Parameter Specification
CPU ARM926EJ
RAM (MB) 64
Internal DRAM (MB) 256
NAND Interface Yes
Graphic LCD Interface MIPI DSI, LVDS, RGB
Graphics Controller/GPU 2D GPU
Camera Interface MIPI CSI2, Parallel
QSPI 1
USART 12
SPI 12
I2C 12
I2S 1
10/100/1000 Ethernet MAC 1
CAN/CAN FD 2
SD/SDIO/SD – CARD/eMMC 2
Class D Amplifier Output Yes
ADC Channels 8
ADC Resolution (bits) 12
Secure Bootloader Yes
Anti Tampering Inputs 8
Secure Key Storage (bits) 10 KByte OTP
CODEC Interface (I2S, AC97) Yes
32 – Bit Digital Timers 2
ADC Sampling Rate (ksps) 1000
I/O Pins Max 67
Low Power Yes
CPU Speed Max (MHz) 800
Ext. DRAM Bus 16
HW Video Decoder No
Type of CAN module CAN FD
Crypto Engine Yes
ARM Trust Zone No
External Memory Encryption/Decryption No
Integrity Check Monitor (ICM) No
Environmental Monitors No
Pincount 174
Packages 33×8 mm 174 pin 0.85 mm PBGA/Tech Module

 

Category Details
System – in – Package Components • ARM926EJ – S Arm Thumb processor – based SAM9X75 MPU running up to 800 MHz
• 2 – Gbit DDR3L
• 4 – Gbit NAND Flash Memory
• 64 – Mbit Serial Quad I/O Flash Memory (SST26VF064BEUT – 104/MI) with Embedded EUI – 48™ and EUI – 64™ MAC Addresses
• On – Board Power Management Unit (MCP16502T – AB – E/S88)
• Gigabit Ethernet Transceiver (LAN8840T – W/PSA)
Oscillators • 24 – MHz Crystal Oscillator for microprocessor main clock generation
• 25 – MHz MEMS Crystal Oscillator and 125 – MHz MEMS Oscillator (DSC1501M12A – 125.0000) for Ethernet clock generation
• 32.768 – kHz Crystal Oscillator for slow clock generation
USB One High – Speed USB Device, three High – Speed USB Hosts with dedicated on – chip transceivers
Control Pins Shutdown and Reset Control Pins
I/Os Up to 67 I/Os
Power Supplies Independent Power Supplies available for SD Cards, RGB LCD, LVDS Display, Camera Sensor and Backup depending on voltage domains
Operational Conditions • Main operating voltage (5V_MAIN): 3.3V to 5.5V ± 5%
• Module ambient temperature range (TA) range: – 40°C to + 85°C
Package 35×30 mm 174 – pin 0.65 mm Pad Pitch Module, manually solderable for prototyping

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