描述
| Parameter | Specification |
|---|---|
| CPU | Cortex – A7 |
| CPU Speed Max (MHz) | 1000 |
| L2 Cache | 256 |
| ARM Neon | Yes |
| FPU | Yes |
| RAM (MB) | 128 |
| Internal DRAM (MB) | 256 |
| Int. DRAM Type | DDR3L |
| NAND Interface | Yes |
| Graphic LCD Interface | MIPI DSI, LVDS, RGB |
| Graphics Controller/GPU | 2D GPU |
| Octal SPI | yes |
| QSPI | 2 |
| USART | 11 |
| SPI | 11 |
| I2C | 11 |
| I2S | yes |
| 10/100/1000 Ethernet MAC | 2 |
| Ethernet TSN Support | yes |
| USB Interface | 1 HS Host, 2 HS Host/Device |
| USB Type C support | yes |
| CAN/CAN FD | 5 |
| Type of CAN module | CAN FD |
| SDIO/SD – CARD/eMMC | 3 |
| ADC Channels | 16 |
| ADC Resolution (bits) | 12 |
| Crypto Engine | Yes |
| Secure Bootloader | Yes |
| ARM Trust Zone | Yes |
| External Memory Encryption/Decryption | Yes |
| Integrity Check Monitor (ICM) | Yes |
| Anti – Tampering Inputs | 4 |
| Environmental Monitors | Yes |
| Secure Key Storage (bits) | 11 Kbyte OTP |
| TempRange Min | -40 |
| TempRange Max | 105 |
| I/O Pins Max | 142 |
| Pincount | 427 |
| Packages | TFBGA |
| Direct Memory Access (DMA) Channels | 72 |
| Category | Details |
|---|---|
| Core & Memory | • Secure Arm Cortex – A7 based MPU with advanced graphic features running up to 1GHz • 256KB L2 cache • 128 KBytes SRAM + 5 KBytes Secure SRAM • 256 MBytes / 2Gbit Integrated 533MHz DDR3L |
| Audio Sub – System | • I2S, PDM, SPDIF (Rx/Tx), 4 stereo channel ASRC |
| HMI Features | • LCD controller with a 2D GPU supporting resolution up to WXGA/720p • MIPI DSI – 4 (4 – lane), LVDS and 8 – bit Serial RGB interface |
| Connectivity Options | • Dual Gbit Ethernet MAC supporting TSN/AVB • Three HS USB Phy, 5x CAN – FD, 3x SD/eMMC • One I3C controller interface |
| Fully – Integrated Security Features | • ARM TrustZone • Secure Boot w/ HW Cryptography (AES/TEDS/SHA/RSA/ECC) • FIPS – compliant TRNG plus 11 kb OTP for key storage • On – the – fly encryption/decryption from external memories |
| Package | • TFBGA427 18mm x 21mm, 0.80 mm pitch • Optimized BGA ball – out facilitates 4 – layer PCB designs |
| Power Management | • Optimized Power Management IC and Integrated LDOs • Voltage and frequency scaling support |
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